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Details about Applied Materials (AMAT) 0020-31775 RING, CERAMIC SEMICONDUCTOR PART Applied Materials (AMAT) 0020-31775 RING, CERAMIC SEMICONDUCTOR PART Item Information Packaging connects the chip to the rest of the system and helps protect it from physical damage and environmental threats, including moisture, humidity and radiation. Applied Materials, Inc. (AMAT) ist einer der weltgrößten Hersteller von Anlagen für die Halbleiterindustrie mit Sitz in Santa Clara, Kalifornien im Silicon Valley (USA). Those interested in leveraging these innovations to new areas might benefit by licensing technologies from Applied, possibly resulting in lower product development costs, faster market penetration, and accelerated revenue growth for the licensee.Applied’s IP portfolio includes more than 8,000 patents worldwide and technologies in the following areas:Moving into the Predictive Space with Virtual MetrologyFollow the company to be always up to date with this companyMoving into the Predictive Space with Virtual Metrology E-beam review enables potential defects to be visualized and characterized. These films are formed, deposited, shaped and measured by patented Applied Materials processes and tools that provide near-atomic levels of precision and control.Applied Materials creates sophisticated, commercialised manufacturing systems for ultra-high volume manufacturing and efficiency to drive down the cost of electronic devices.

Its technologies help make innovations like smartphones, flatscreen TVs and solar panels more affordable and accessible to consumers and businesses around the world. Also in 2006, Applied announced it was entering the solar manufacturing equipment business. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. Applied Materials is the number one equipment supplier to the semiconductor, liquid crystal display (TFT … Applied’s inspection, review, and metrology technologies help enable today’s most challenging materials and device engineering which in turn make accurate and complete measurement and imaging more difficult. Chipmakers rely on patterned wafer inspection, defect classification and review, metrology, and statistical analysis to design fabrication recipes and ensure that processes and tools adhere to process window parameters throughout the fabrication process.



Remaining solar business activities have been included in "Corporate and Others".Applied operates in many locations globally, including in Europe, Japan, North America (principally the United States), Israel, China, Italy, India, Korea, Southeast Asia and Taiwan. Applied Materials turns today’s innovations into the industries of tomorrow.

These technologies include optical proximity correction mask qualification and self-aligned double and quadruple patterning.
The Internet of Things, Big Data and artificial intelligence (AI) demand rapid, dramatic improvements in chip power efficiency, performance, area, cost, and time to market (PPACt). These activities generate many technologies that potentially have applications beyond the domains for which they were developed. These can arise from ever-decreasing device sizes; changes in materials used (such as high-k films or ultra-porous dielectrics); diversification in device architecture (such as FinFETs and 3D NAND transistors), and new packaging approaches (such as TSV technology).

The package can also help dissipate heat so that the chip can operate cooler and more reliably.

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